PRN: Thin Film Deposition: Trends, Key Issues, Market Analysis

11/apr/2014 11:51:52 PR Newswire Turismo Contatta l'autore

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Thin Film Deposition: Trends, Key Issues, Market Analysis

 
[11-April-2014]
 

DUBLIN, April 11, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/6njz3z/thin_film) has announced the addition of the "Thin Film Deposition: Trends, Key Issues, Market Analysis." report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


Thin film deposition processes play a critical role in the production of high-density, high-performance microelectronic products. Considerable progress has been achieved in the development of deposition processes -- and in the development of the reactor systems in which they are carried out.

This report discusses the technology trends, products, applications, and suppliers of materials and equipment.

It also gives insights to suppliers for future user needs and should assist them in long range planning, new product development and product improvement.

This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD.


Key Topics Covered:

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Physical Vapor Deposition
3.1 Introduction
3.2 Sputtering Technology
3.3 Plasma Technology
3.4 Reactor Designs
3.5 Semiconductor Processing
3.6 Targets

Chapter 4: Chemical Vapor Deposition
4.1 Introduction
4.2 Chemical Vapor Deposition (CVD) Techniques

Chapter 5: Electrochemical Deposition
5.1 Introduction
5.2 Reactor Design
5.3 Challenges
5.4 Additives
5.5 Processing
5.6 Copper Cathodes

Chapter 6: Film Deposition And Film Properties
6.1 Introduction
6.2 Dielectric Deposition
6.3 Metal Deposition

Chapter 7: Vendor Issues
7.1 Introduction
7.2 300mm Processing
7.3 Integrated Processing
7.4 Copper
7.5 Metrology
7.6 ESD
7.7 Parametric Test

Chapter 8: Market Forecast
8.1 Introduction
8.2 Key Issues
8.3 Market Forecast Assumptions
8.4 Market Forecast
8.4.1 Chemical Vapor Deposition
8.4.2 Physical Vapor Deposition
8.4.3 Copper Electroplating Market
8.4.4 Atomic Layer Deposition Market



For more information visit http://www.researchandmarkets.com/research/6njz3z/thin_film


Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net


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