PRN: Global Wafer Fab Equipment Market 2016-2020 - Increase in Number of Fabs Worldwide / Long Payback Period / Increase in Wafer Size

26/gen/2016 17.11.03 PR Newswire Turismo Contatta l'autore

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Global Wafer Fab Equipment Market 2016-2020 - Increase in Number of Fabs Worldwide / Long Payback Period / Increase in Wafer Size

 
[26-January-2016]
 

DUBLIN, Jan. 26, 2016 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/558dmd/global_wafer_fab) has announced the addition of the "Global Wafer Fab Equipment Market 2016-2020" report to their offering.

The global wafer fab equipment market to grow at a CAGR of 4.02% during the period 2016-2020.

Global Wafer Fab Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

The wafer fab equipment used in the manufacturing of 32 nanometer (nm) node integrated circuits (ICs) contributed 32.18% of the total market in 2015. The foundry segment is the largest revenue contributor, and accounted for a revenue share of 62.98% in 2015

APAC has been the major revenue generator to the market, and contributed a total amount of $23.52 billion in 2015

Over the last four decades, the semiconductor industry has seen an increase in the size of silicon wafers from 100 mm wafers to 300 mm wafers. The shift to larger diameter wafers reduces the cost of manufacturing semiconductor ICs by 20% to 25%. The semiconductor industry is primarily using 300 mm wafer for manufacturing ICs. This trend is expected to continue during the forecast period, as companies are spending heavily on upgrading the existing fabs and constructing new fabs for manufacturing 300 mm wafers.

According to the report, growth in the number of fabs has led to the rising demand for wafer fab equipment globally. Vendors are setting up new fabs in different countries for the production of memory devices like DRAM and NAND.

Further, the report states that due to longer payback period of advanced manufacturing equipment, many semiconductor device manufacturers are hesitant to invest in these equipment.

To calculate the market size, the report considers the revenue generated from the sales of the wafer fab equipment to the following customer segments:

  • Foundries
  • Memory
  • Integrated device manufacturers (IDM)

Key vendors

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • TEL

Other prominent vendors

  • Dainippon Screen Manufacturing
  • Hitachi High Technologies
  • Nikon
  • Hitachi Kokusai Electric.

Key Topics Covered:

Part 01: Executive summary

Part 02: Scope of the report

Part 03: Market research methodology

Part 04: Introduction

Part 05: Market landscape

Part 06: Market segmentation by node size

Part 07: Market segmentation by end user

Part 08: Geographical segmentation

Part 09: Market drivers

Part 10: Market challenges

Part 11: Impact of drivers and challenges

Part 12: Market trends

Part 13: Vendor landscape

Part 14: Key vendor analysis

Part 15: Key recommendations for vendors/investors

Part 16: Appendix

For more information visit http://www.researchandmarkets.com/research/558dmd/global_wafer_fab

Media Contact:

Laura Wood , +353-1-481-1716, press@researchandmarkets.net

 

 

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