PRN: Complete Tear-Down Analysis of Delphi's RACam Integrated Radar and Camera

18/feb/2016 15.10.40 PR Newswire Turismo Contatta l'autore

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Complete Tear-Down Analysis of Delphi's RACam Integrated Radar and Camera

 
[18-February-2016]
 

DUBLIN, Feb. 18, 2016 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/qnhbg5/delphi_racam) has announced the addition of the "Delphi RACam: Integrated Radar and Camera - Complete Tear-Down Analysis" report to their offering.

Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.

The visual detection is performed by a 1/3 CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.

Based on a complete teardown analysis of the Delphi RACam, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. The report also includes analysis of the Image Sensor and Lens module. A structural analysis, with a comparison with Bosch MRR1, highlights the technical choices in RF design made by Delphi.

Key Topics Covered:

1. Overview/Introduction - Executive Summary -- Company Profile : Delphi -- Reverse Costing Methodology

2. Physical Analysis

- Global View of the Radar

- Views and Dimensions of the Radar

- Radar Disassembly

- Camera Module Disassembly

- Lens Module

- Electronic Boards

-- MCU Board

-- RF Board

-- Camera Module Board

-- Waveguide Board

-- Antenna Board

- RF Design

- Cross Section and EDX Analysis

- RRN7740 and RTN7750

-- Views and Dimensions

-- Detail Functions

- Mobileye EyeQ3

-- Views and Dimensions

-- Opening

3. Cost Analysis - Estimation of the cost of the PCBs - Estimation of the Cost of the MCU - Estimation of the Cost of the CMOS Image Sensor - BOM Cost - MCU Board - BOM Cost - RF Board - BOM Cost - Camera Module - BOM Cost - Housing - Material Cost Breakdown - Accessing the Added Value (AV) cost - MCU Board Manufacturing Flow - RF Board Manufacturing Flow - Details of the Housing Assembly & Functional Test Costs - Added Value Cost Breakdown - Manufacturing Cost Breakdown

4. Estimated Price Analysis

- Estimation of the Manufacturing Price

Companies Mentioned

- Delphi

- Infineon

For more information visit http://www.researchandmarkets.com/research/qnhbg5/delphi_racam

Media Contact:

Research and Markets

Laura Wood, Senior Manager

press@researchandmarkets.com

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