PRN: Global Die Bonder Equipment Market to Grow at a CAGR of 2.28% by 2021: One Driver in Market is Incentives & Discounts for Long-term Customers - Research and Markets

02/mag/2017 12:45:14 PR Newswire Turismo Contatta l'autore

Questo comunicato è stato pubblicato più di 1 anno fa. Le informazioni su questa pagina potrebbero non essere attendibili.

Global Die Bonder Equipment Market to Grow at a CAGR of 2.28% by 2021: One Driver in Market is Incentives & Discounts for Long-term Customers - Research and Markets

 
[02-May-2017]
 

DUBLIN, Apr 2, 2017 /PRNewswire/ --

Research and Markets has announced the addition of the "Global Die Bonder Equipment Market 2017-2021" report to their offering.

Research and Markets Logo

The global die bonder equipment market to grow at a CAGR of 2.28% during the period 2017-2021.

The report, Global Die Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

According to the report, one driver in market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is defined by relationship-based sales. The selling price of such equipment is usually in the range of $100,000 to $1,000,000. Therefore, manufacturers develop long-standing relations with customers for buying their products. The main aim of such relations is to convince their customers to procure the necessary equipment from them by offering incentives and discounts for future purchases.

Equipment manufacturers mostly target those customers who tend to procure equipment for a significant sum, thereby accounting for more than 5%-10% of their global sales. Semiconductor device manufacturers and packaging houses may consider repeated purchase in the future as they get attracted by the discounts and incentives. Thus, equipment vendors offer price discounts to have a sustaining customer base.

Key vendors

  • ASM Pacific Technology (ASMPT)
  • Kulicke & Soffa
  • Palomar Technologies

Other prominent vendors

  • Besi
  • DIAS Automation
  • Hesse
  • Hybond
  • SHINKAWA
  • Toray Engineering
  • West-Bond

Market drivers
- Demand for high-quality semiconductor ICs for wireless devices and IoT applications.
- For a full, detailed list, view the full report

Key Topics Covered:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

PART 05: Market landscape

PART 06: Market segmentation by end-user

PART 07: Geographical segmentation

PART 08: Key leading countries

PART 09: Decision framework

PART 10: Drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

PART 13: Appendix

For more information about this report visit http://www.researchandmarkets.com/research/d3dlqj/global_die_bonder

Media Contact:


Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com

For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

 



blog comments powered by Disqus
Comunicati.net è un servizio offerto da Factotum Srl